> The manufacturing cost is emphatically not only 1% of the total development cost.
I have no idea what is the manufacturing cost of a 800 mm^2 die is, but I am sure it is lower than the development cost.
> Particularly for GPUs, the high bandwidth memory and manufacturing costs are a significant portion of the product price.
HBM is not manufactured by the GPU vendor, it is an off-the-shelf component that AMD buys like any other company can. Thus, the cost of HBM is tallied in the BOM and integration costs (interposer, packaging, etc).
800mm^2 die would roughly cost 300-350 usd axcoeding to [1]. That's the Taiwan price and dor N4. This doesn't include the memory or the package. The silicon cost for N3 is close to 2x.
Well, seems that increase of 20% for US-based manufacturing on a base cost of $350 is $70. MSRP of 5090 is $1,999. So, on shoring will result in 3.5% increase in MSRP, which is nothing.
I have no idea what is the manufacturing cost of a 800 mm^2 die is, but I am sure it is lower than the development cost.
> Particularly for GPUs, the high bandwidth memory and manufacturing costs are a significant portion of the product price.
HBM is not manufactured by the GPU vendor, it is an off-the-shelf component that AMD buys like any other company can. Thus, the cost of HBM is tallied in the BOM and integration costs (interposer, packaging, etc).