I think even for a company like TSMC these ideas are important to understand.
To give you an example TSMC might have a factory with 10 expensive EUV lithography tools, each capable of processing 100 wafers per hour.
Then they have 4 ovens, each able to bake batches of 500 wafers per hour.
TSMC could improve efficiency by reducing the number of ovens, because they are running only at 50% capacity. But compared to the cost of the EUV tools, the ovens are very cheap. They need to be able to produce at full capacity, even when some ovens breakdown, because stopping the EUV tools because you don't have enough ovens would be much more expensive then operating with spare capacity.
To give you an example TSMC might have a factory with 10 expensive EUV lithography tools, each capable of processing 100 wafers per hour. Then they have 4 ovens, each able to bake batches of 500 wafers per hour.
TSMC could improve efficiency by reducing the number of ovens, because they are running only at 50% capacity. But compared to the cost of the EUV tools, the ovens are very cheap. They need to be able to produce at full capacity, even when some ovens breakdown, because stopping the EUV tools because you don't have enough ovens would be much more expensive then operating with spare capacity.