Complete n00b question -- this is very, very far outside my domain -- but by using much more of a chip in parallel, does this present any challenging thermal implications?
This is a concern orthogonal to our work. Today, there are commercial chips with a large number of cores / processing elements today, e.g. NVidia's Volta has ~5120 "cores", Intel's Xeon Phi has upto 72 cores. And there are approaches and active research to handle thermal concerns in such large chips. Maybe someone who is more knowledgeable can shed light on those approaches. I do not think Fractal introduces any new thermal concerns.
