Yes, it's a similar idea. These terms get repeated SoC used to refer to a single chip CPU, and they keep reusing the term as other components get integrated.
Anyway, I am referring to packaging like: http://cdn.arstechnica.net/wp-content/uploads/2013/04/ASIC_+... Yes, HBM also does more or less the same thing. The issues are twofold heat which is vastly less of a problem in the mobile world so with HBM it's a stack of ram chips next to a processer, with Mobil the CPU is under what might only be one RAM chip and they call it SoC.
Note: CPU's are already 3d with many layers depending on how you count.
Anyway after die size, heat, latency, and manufacturing costs are really the largest factors. Some PC ram chips run hot enough they really can't be stacked. You can slow them down and trade latency for total bandwidth. ed:Less of an issue with active cooling and a heat sink. However, they can call this HBM, because you can have more chips so even if each chip is slower overall you get higher speeds.
PS: Don't forget HBM is designed for a GPU/CPGPU without a large cache. CPU's have a huge cash which let's them have very different approach aka lot's of cheap but slow RAM. Benchmarks show faster ream really does not add much for a modern CPU with most workloads. You could use this for a CPU but it's harder to swap in more ram.
Anyway, I am referring to packaging like: http://cdn.arstechnica.net/wp-content/uploads/2013/04/ASIC_+... Yes, HBM also does more or less the same thing. The issues are twofold heat which is vastly less of a problem in the mobile world so with HBM it's a stack of ram chips next to a processer, with Mobil the CPU is under what might only be one RAM chip and they call it SoC.
http://arstechnica.com/gadgets/2013/04/the-pc-inside-your-ph...
Note: CPU's are already 3d with many layers depending on how you count.
Anyway after die size, heat, latency, and manufacturing costs are really the largest factors. Some PC ram chips run hot enough they really can't be stacked. You can slow them down and trade latency for total bandwidth. ed:Less of an issue with active cooling and a heat sink. However, they can call this HBM, because you can have more chips so even if each chip is slower overall you get higher speeds.
PS: Don't forget HBM is designed for a GPU/CPGPU without a large cache. CPU's have a huge cash which let's them have very different approach aka lot's of cheap but slow RAM. Benchmarks show faster ream really does not add much for a modern CPU with most workloads. You could use this for a CPU but it's harder to swap in more ram.