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The first point was meant to illustrate that it's not good enough to say that it's okay to not innovate because there's no better hardware available. I'm not suggesting that GM would seriously put a potted development board inside a vehicle. TI can simply produce automotive-grade equivalents for them.

What I'm suggesting is that things like higher sampling rates of input sensors and more composability and reusability can be realized by a newer, more standardized and open approach to hardware.

I would also wager that the outcome of failure would be the same as with the traditional systems. GM shifts the blame onto the ECU development shop that it contracted out to make the hardware or software, or the QE shop that failed to pick up the failure.

Vehicle electronics are typically rated from -40C to 125C, although it's seen that they routinely fail even inside these margins. The BBB for example can have an operating temperature from -40C to 85C. There are also plenty of industrial boards that meet or exceed the requirements of automotive operating environments. Companies such as TI are (in part) releasing development boards (such as the BBB) to try to inspire innovation in these environments. The dev boards themselves aren't rated for it, but the platform can be.



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