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I suspect this is the result of DARPA’s big interposer push and it’s leaking now because of the change in leadership there.

Specifically TSMC has breakthrough CoWoS interposers, can’t meet demand, and the military is bottlenecked without a chiplet path made in the USA.



Something like that seems to make sense considering the investment is relatively tiny and that the factory is gonna be about 1/5th the size of the usual TSMC factory.

So it does appear like this is intended for a specific chip for a specific purpose.




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